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New challenges for PIC testing
Photonic integrated circuits (PICs) are the chips of the future.
Speed up the world

UFO Probe® Technology keeps you one step ahead
Built-in solution for high-volume production

All benefits of the Probe Card Technology on one view
Progress
The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.
Innovation
The only commercial test solution for high-volume production that can run on standard test equipment.
Quality
Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.
Plug and Play
It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.
Efficiency
Fault parts are identified early on for increased yield and optimized production flow.
Flexibility
The pitch and number of optical I/O channels can be configured to suit you.
Enabling optical data communication

Probe card applications now and in the future
Easy integration into existing test infrastructure

Detailed view of a built-in probe card
UFO Probe® card allows parallel IC and PIC testing

- Monolithic optical module
- Orientation-insensitive optical coupling for vertically emitting PICs
- Simultaneous optical and electrical scanning
- Optical concept compensates prober alignment tolerances
- Use of proven needle technology (partnership with test card manufacturers)
- Standard interface to wafer sampler can be implemented: e.g. European card format
Technical details of the UFO Probe® optoelectronic card
Specifications | Current generation | Future generations |
---|---|---|
Component to be tested | Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications | EPIC for transceivers, photodiodes, |
Electric needle technology | Cantilever and Vertical | Cantilever, vertical/advanced |
Optical coupling principle DUT | Vertical coupling | Vertical coupling |
Number of optical inputs/outputs (OI/OO) | Up to 32 or more | <200 |
Pitch OI/OO | 127 μm, 250 μm, flexible for >250 μm | flexible |
Layout configuration of OI/OO arrays | Linear arrangement with same direction of inputs/outputs | Configurable to own needs |
Coupling angle | 0° and 11.6° standard, up to 20° customized | 0° - 20° |
Supported wavelength | 1260 - 1625 nm (O/ L-band) | VIS to NIR (U-band) |
Measurement of insertion loss | Repeatability: ~ 0.3 – 0.5 dB | Repeatability target: 0.1 dB |
RF measurement | Up to 110 GHz, depending on needle technology | GHz |
Interfaces | Eurocard format; ATE* | Eurocard format; |
Detailed Product Information
