New challenges for PIC testing

Photonic integrated circuits (PICs) are the chips of the future.

Photonic integrated circuits use light instead of electricity for data transmission and processing. PICs are manufactured in a variety of designs on wafers using classical lithography techniques and existing equipment from established semiconductor manufacturers. However, wafer testing presents its own unique challenges. Due to the additional optical components to be tested, the test throughputs are not yet as high as for established IC functional tests. Test solutions for visual inspection also still need to be procured and integrated. In addition, a complex realignment of the optical interfaces of the test equipment in the submicron range is required for each chip.

Speed up the world

Thanks to Photonic Integrated Circuits (PICs), optics is becoming the key to fast data communication. The UFO Probe^®Card for PIC wafer level testing is setting new standards, linking the present and the future.

UFO Probe® Card

Testing of optical and electronic functionalities is a crucial factor in wafer production. In high-volume production, it is important to keep both test and setup times low in order to remain economical. This is where UFO Probe® technology offers the right solution, as it enables electrical and optical components of each chip to be tested simultaneously, thus saving time. It is based on a concept for optical scanning of photonic integrated circuits that is insensitive to wafer probers alignment tolerances. The opto-electronic probe card can therefore be used with commercially available wafer prober and ensures a correspondingly high throughput when testing photonic integrated circuits.

A step ahead with Jenoptik

The UFO Probe® Card enables simultaneous electrical and optical testing of chips on wafers with one single probe card. It can be integrated into existing test infrastructure for established electrical function tests - thus eliminating the need for expensive investments in stand-alone solutions.

Progress

The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.

Innovation

The only commercial test solution for high-volume production that can run on standard test equipment.

Quality

Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.

Plug and Play

It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.

Efficiency

Fault parts are identified early on for increased yield and optimized production flow.

Flexibility

The pitch and number of optical I/O channels can be configured to suit you.

Enabling optical data communication

Probe card applications now and in the future

The current UFO Probe^®technology is specifically designed for wafer testing of photonic integrated circuits (PICs), especially for optical transceivers. Other applications include: LEDs/micro-LEDs, VCSEL, photo diodes, MEMS mirrors and PCM structures.

Fingerprint Sensor with a thumb — **Bio Sensors**

Modern technology and computing concept on virtual screen. — **Optical quantum chips**

3d rendering robotic arms with silicon wafers for semiconductor manufacturing — **Process monitoring structures**

fotodiode ufo probe card — **Photo Diodes**

produktion optoelektronik — **Production optoelectronics**

vorheriges Bild anzeigen nächste Bild anzeigen

They can easily be integrated into existing test infrastructure

The UFO Probe^® Card is intended to be used for operation on standard IC-Probers and/or automated test equipment. So, Jenoptik offers a plug-and-play solution for PIC wafer level tests. Depending on requirements, standard interfaces to wafer samplers can be easily implemented in the layout/design of the probe card – for example, in European card format. The handling is similar to that of electrical probe cards, so existing personnel won't need extensive extra training.

UFO Probe® card allows parallel IC and PIC testing

Monolithic optical module
Orientation-insensitive optical coupling for vertically emitting PICs
Simultaneous optical and electrical scanning
Optical concept compensates prober alignment tolerances
Use of proven needle technology (partnership with test card manufacturers)
Standard interface to wafer sampler can be implemented: e.g. European card format

Technical details of the UFO Probe^® optoelectronic card

Specifications	Current generation	Future generations
Component to be tested (Device under test/DUT)	Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications	EPIC for transceivers, photodiodes, biosensors and Solid State LIDAR
Electric needle technology	Cantilever and Vertical	Cantilever, vertical/advanced
Optical coupling principle DUT	Vertical coupling	Vertical coupling
Number of optical inputs/outputs (OI/OO)	Up to 32 or more	<200
Pitch OI/OO	127 μm, 250 μm, flexible for >250 μm	flexible
Layout configuration of OI/OO arrays	Linear arrangement with same direction of inputs/outputs	Configurable to own needs
Coupling bracket	0° and 11.6°	0° - 20°
Supported wavelength	1,310 nm and 1,550 nm	VISto NIR (U-band)
Measurement of insertion loss	Repeatability: ~ 0.3 – 0.5 dB	Repeatability target: 0.1 dB
RF measurement	Up to 100 MHz	GHz
Interfaces	European card format	European card format, ATE interface

Detailed Product Information

For more information please click.

Hybrid technology platform

UFO Probe^® Card allows a simultaneous testing of ICs and PICs for an increased yield and reduced testing time.

Combines optical and electrical probing
Optical module for multiple optical DUT interfaces or multi-DUT tests.
Alignment insensitive optical coupling for vertical emitting PICs
Cantilever and vertical needle setup as electrical interface to the DUT/ Utilize proven needle technology

For more information please click.

Precise touchdowns save valuable time

UFO Probe^® Card´s optical concept compensates prober alignment tolerances to reduce valuable time.

RX, TX, alignment channel and comprehensive electrical tests in one single touchdown
1x alignment per batch, no additional alignment per chip

For more information please click.

Relies on existing infrastructure

Enables you to take the next step integrating new technologies as Photonics Integrated Circiuts (PICs) by providing a testing solution that:

Works on existing wafer probers and test equipment
Can be operated by the same personnel as for conventional electronic testing.
Requires no additional effort (training, system adjustment)
Design changes to other interfaces possible

The modern world needs optical data communication and solutions for efficient manufacturing

Do you have any questions? Our experts are happy to help.

Enrico Piechotka

Global Product Group Manager

+49 3641 65-2441

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