New challenges for PIC testing
Photonic integrated circuits (PICs) are the chips of the future.
Speed up the world
UFO Probe® Technology keeps you one step ahead
Built-in solution for high-volume production
All benefits of the Probe Card Technology on one view
The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.
The only commercial test solution for high-volume production that can run on standard test equipment.
Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.
Plug and Play
It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.
Fault parts are identified early on for increased yield and optimized production flow.
The pitch and number of optical I/O channels can be configured to suit you.
Enabling optical data communication
Probe card applications now and in the future
Easy integration into existing test infrastructure
UFO Probe® card allows parallel IC and PIC testing
- Monolithic optical module
- Orientation-insensitive optical coupling for vertically emitting PICs
- Simultaneous optical and electrical scanning
- Optical concept compensates prober alignment tolerances
- Use of proven needle technology (partnership with test card manufacturers)
- Standard interface to wafer sampler can be implemented: e.g. European card format
Technical details of the UFO Probe® optoelectronic card
|Specifications||Current generation||Future generations|
Component to be tested
Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications
EPIC for transceivers, photodiodes,
Electric needle technology
Cantilever and Vertical
Optical coupling principle DUT
Number of optical inputs/outputs (OI/OO)
Up to 32 or more
127 μm, 250 μm, flexible for >250 μm
Layout configuration of OI/OO arrays
Linear arrangement with same direction of inputs/outputs
Configurable to own needs
0° and 11.6° standard, up to 20° customized
0° - 20°
1260 - 1625 nm (O/ L-band)
VIS to NIR (U-band)
Measurement of insertion loss
Repeatability: ~ 0.3 – 0.5 dB
Repeatability target: 0.1 dB
Up to 110 GHz, depending on needle technology
Eurocard format; ATE*