UFO Probe® card – new test card for PIC wafer testing

Photonic Integrated Circuits (PICs) are the chips of the future. Integrated photonics use light instead of electricity for data and signal processing.

The UFO Probe^®card is the tool for simultaneously testing the optical and electronic functionalities of PIC. The Jenoptik probe card is based on a concept for optical scanning of photonic integrated circuits, which is insensitive to alignment tolerances of the wafer sampler. The opto-electronic test card can, therefore, be used with commercially available wafer samplers and ensures a correspondingly high throughput when testing photonic integrated circuits.

Speed up the world

Thanks to Photonic Integrated Circuits (PICs), optics is becoming the key to fast data communication. The UFO Probe^®card for PIC wafer level testing is setting new standards, linking the present and the future.

New challenges for wafer testing

PICs are produced in a wide variety of designs on wafers using classic lithography methods and with existing equipment from established semiconductor manufacturers. The wafers are manufactured in almost the same way as electronic components.

Wafer testing poses its own unique challenge. Due to additional optical components to be tested, the test throughput rates have not yet been achieved as is the case with established IC function tests. Test solutions for visual inspection still have to be procured and integrated, too. A complex realignment of the optical interfaces of the test device in the submicron range is also required for each chip.

A step ahead with Jenoptik

The UFO Probe^® card allows simultaneous testing of electronic and optical functions for the first time – i.e. ICs and PICs – with just one test card. What's special about this case is that both work on existing test infrastructure. Furthermore, the UFO Probe^® card from Jenoptik does not require each chip to be set up individually. This saves a lot of time.

Progress

The PIC ecosystem can be expanded thanks to an efficient test method for high-throughput serial production; and the test time is reduced thanks to parallel qualification of multiple chips.

Innovation

The only commercial test solution for high-volume production that can run on standard test equipment.

Quality

Scrap is identified at an early stage of production for improved yield: All testing of all PICs can be carried out on a wafer.

Plug and Play

It is designed to operate in standard IC testers and automated testers. Low outlay and commissioning costs.

Efficiency

Fault parts are identified early on for increased yield and optimized production flow.

Flexibility

The pitch and number of optical I/O channels can be configured to suit you.

Enabling optical data communication

Probe card applications now and in the future

The current UFO Probe^®technology is specifically designed for wafer testing of photonic integrated circuits (PICs), especially for optical transceivers. Other applications include: LEDs/micro-LEDs, VCSEL, photodiodes, MEMS mirrors and PCM structures.

Fingerprint Sensor with a thumb — **Bio Sensors**

Modern technology and computing concept on virtual screen. — **Optical quantum chips**

3d rendering robotic arms with silicon wafers for semiconductor manufacturing — **Process monitoring structures**

fotodiode ufo probe card — **Photo Diodes**

produktion optoelektronik — **Production optoelectronics**

vorheriges Bild anzeigen nächste Bild anzeigen

They can easily be integrated into existing test infrastructure

The UFO Probe^® card is intended to be used for operation on standard IC probers and/or automated test equipment. So, Jenoptik offers a plug-and-play solution for PIC wafer level tests. Depending on requirements, standard interfaces to wafer samplers can be easily implemented in the layout/design of the probe card – for example, in European card format. The handling of the UFO Probe^® card is similar to that of electrical test cards, so existing personnel won't need extensive extra training.

UFO Probe® card allows parallel IC and PIC testing

Function of the UFO Probe®Card: parallel testing of ICs and PICs

Monolithic optical module
Orientation-insensitive optical coupling for vertically emitting PICs
Simultaneous optical and electrical scanning
Use of proven needle technology (partnership with test card manufacturers)
Standard interface to wafer sampler can be implemented: e.g. European card format

Technical details of the UFO Probe^® optoelectronic card

Specifications	Current generation	Future generations
Component to be tested (Device under test/DUT)	Electronic and photonic integrated circuit (EPIC); optical transceivers for data transmission and telecommunications applications	EPIC for transceivers, photodiodes, biosensors and Solid State LIDAR
Electric needle technology	Cantilever	Cantilever, vertical/advanced
Optical coupling principle DUT	Vertical coupling	Verticalcoupling
Number of optical inputs/outputs (OI/OO)	Up to 16	<200
Pitch OI/OO	250 μm	flexible
Layout configuration of OI/OO arrays	Linear arrangement with same direction of inputs/outputs	Configurable to own needs
Coupling bracket	0° and 11.6°	0° - 20°
Supported wavelength	1,310 nm and 1,550 nm	VISto NIR (U-band)
Measurement of insertion loss	Repeatability: ~ 0.3 – 0.5 dB	Repeatability target: 0.1 dB
RF measurement	Up to 100 MHz	GHz
Interfaces	European card format	European card format, ATE interface

Detailed Product Information

For more information please click.

Hybrid technology platform –

UFO Probe^® Card allows a simultaneous testing of ICs and PICs for an increased yield and reduced testing time.

Combines optical and electrical probing
Optical module with passive optical circuitry for multiple optical I/O’s and active components for direct detection
Alignment insensitive optical coupling for vertical emitting PICs
Cantilever needle setup as electrical interface to the DUT/ Utilize proven needle technology

For more information please click.

Precise touch-downs save valuable time –

UFO Probe^® Card´s optical concept compensates prober alignment tolerances to reduce valuable time.

RX, TX, alignment channel and comprehensive electrical tests in one single touch-down
1x alignment per batch, no additional alignment per chip

For more information please click.

Relies on existing infrastructure –

Enables you to take the next step integrating new technologies as Photonics Integrated Circiuts (PICs) by providing a testing solution that:

Works on existing wafer probers and test equipment
Can be operated by the same personnel as for conventional electronic testing.
Requires no additional effort (training, system adjustment)
Metal frame as standard prober interface (Eurocard format) to probe head plate
Design changes to other interfaces possible

The modern world needs optical data communication and solutions for efficient manufacturing

Do you have any questions? Our experts are happy to help.

Enrico Piechotka

Global Product Group Manager

+49 3641 65-2441

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